for military, industrial,
medical and automotive applications.
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Engineering and Design Give us your specifications, and we will design a circuit for you. Our engineering team will analyze your circuit for optimization of function, thermal analysis, and generate CAD layouts in house, or we can accept your .dwg ir .dxf format drawings, and use your layout. We have extensive experience on all types of packaging, whether it be SIP, DIP, Flatpack, Tub, or TO style packages. MCM type packages include through hole vias, surface mount, and mini-dip configurations. |
A close liaison will be established with your technical staff to insure maximum adherence to your requirements. All manufacturing steps are done in-house so any design changes can be implemented immediately.